1～3 item / All 3 items
Anodic bonding device
Batch processing achieves low dew point. High-precision alignment can be performed in the atmosphere or in a vacuum. Changing the conditions of the joining atmosphere is easy. Since only the necessary parts are heated, distortion is minimal during joining. There is no variation between rods, resulting in good yield. Automation of operations allows for labor savings.
For various sensors and micromachines! A compact and economical type suitable for research and development.
The "Anodic Bonding Device" allows for easy bonding of heated silicon substrates and glass substrates by applying high voltage. It is a compact and economical type suitable for research and development, with a small tabletop design for the alignment section. The standard sample size is 4 inches, with an option for a maximum of 6 inches. It can be used for various sensors, micromachines, biomaterials, and various optical applications. 【Features】 ■ Easily bonds heated silicon substrates and glass substrates by applying high voltage ■ Compact and economical type suitable for research and development ■ Small tabletop design for the alignment section ■ Standard sample size is 4 inches, with an option for a maximum of 6 inches *For more details, please refer to the related links or feel free to contact us.
Anode bonding device
【Specifications】 - High voltage can be easily applied to heated silicon substrates and glass substrates for bonding. - Compact and economical type suitable for research and development. - The alignment section is a small tabletop design. - Standard sample size is 4 inches, with an option for up to 6 inches. Applications - Various sensors, micromachines, biomaterials, and various optical applications.
